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Allegro 17.4 Production of Solder Pads and Packages

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This document provides instructions on how to create solder pads and packages using Allegro 17.4 software. It includes steps on setting up library paths, units, and grids, as well as placing solder pads, adding silk screen markings, and creating route keepout areas. It also explains how to modify the font, create assembly markings, and add place bound areas. The document concludes with instructions on modifying pin colors.

Allegro 17.4 Making Pads and Packages#

Making Pads#

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The stamp hole is a semicircle with a radius of 0.5mm. Therefore, we draw a rectangular pad as an example of a vertical line. The left side is 0.7mm and the right side is 0.7mm, which is a total of 1.4mm. Therefore, we make a surface mount pad with a width of 1.4 and a height of 1.0 (for side pads, swap the width and height for bottom pads).

Open the pad creation software Padstack Editor

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Set library path

Set units and grid

Set text parameters

Package composition elements

Place pads

Add package silkscreen

Cut silkscreen lines

Add REF

Draw Place Bound region

Add Route Keepout region

Modify units

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BEGIN LAYER Top Layer

DEFAULT INTERNAL Middle Layer

END LAYER Bottom Layer

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SOLDERMASK_TOP Solder Mask Layer generally larger by 0.1

SOLDERMASK_BOTTOM Solder Mask Layer generally larger by 0.1

PASTEMASK_TOP Stencil Layer

PASTEMASK_BOTTOM Stencil Layer

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THS1R84D1R02 interpretation: TH through-hole, S square (C circular), outer diameter 1.84mm, D hole diameter inside is 1.02mm

For through-hole pads, we generally increase the physical hole diameter by 0.2, and the value given by the PCB layout generally does not need to be increased.

Making Packages#

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Modify units#

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Modify font#

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0.508 0.635 0.127 0.127 0.127

Modify grid#

Setup->Grids Modify grid size to 0.127mm (5 mil)

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Add pads#

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Enter coordinate command in the lower left corner

X space x space y (x, y are coordinates, for example: X -8.89 0)

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Draw silkscreen#

Click Lin, select top silkscreen, line width 0.15mm

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Geometry package -> Top Silkscreen

ASSEMBLY_TOP Top Assembly Layer

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Set coordinates, ix x coordinate offset left negative right positive, iy y coordinate up positive down negative

Add reference designators#

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Enter the character REF, copy it to the silkscreen layer (if unable to copy, enter two REFs, change one to silkscreen layer, and the other to assembly layer, overlap the two characters)

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Add placebound region#

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Select Place Bound

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Just select the silkscreen part

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Pin color can also be changed#

Select Pin-> Top, left click to modify color

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